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ACM Research (Shanghai): Unveils Multiple Equipment Models Tailored for HBM Processes
2 week ago /
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Author：小编
ACM Research (Shanghai) revealed on an interactive platform that the company has successfully introduced several equipment models that are specifically designed to cater to HBM (High Bandwidth Memory) processes. Among these offerings, the Ultra ECP 3d equipment stands out for its capability in TSV (Through-Silicon Via) copper filling. Furthermore, the entire suite of wet cleaning equipment and copper electroplating equipment, among others, are fully compatible with HBM processes. In addition, the comprehensive range of packaging and testing equipment, encompassing wet process, coating, developing, and copper electroplating equipment, is also well-suited for the 2.5D packaging process of high-performance computing chips.
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