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Electroplating Process: The 'Metal Skeleton' Forger in the World of Advanced Packaging
2025-12-05 /
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Author：小编
Huatian Technology values the core role of electroplating processes in advanced packaging, considering them crucial for achieving high-density and high-performance interconnections. In recent years, the company has increased its R&D investment in electroplating processes for areas such as wafer-level packaging, TSV, and Fan-Out, delving deeply into fine pitch high-density electroplating and deep hole filling technologies, and has already achieved mature mass production capabilities. Currently, Huatian Technology is dedicated to the R&D of electroplating processes for advanced packaging products such as Flip Chip, wafer-level packaging, and 2.5D/3D, continuously achieving new breakthroughs.
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