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Advanced Micro-Fabrication Equipment Inc. (AMEC): Comprehensively Deployed in Advanced Packaging Field, Has Released CCP Etching and TSV Deep Silicon Via Equipment
2025-12-03 /
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Author：小编
On December 3, Advanced Micro-Fabrication Equipment Inc. (AMEC) stated on the investor interaction platform that it has comprehensively deployed in the advanced packaging field (including HBM processes), with products including etching, CVD, PVD, and wafer metrology and inspection equipment, and has released CCP etching and TSV deep silicon via equipment.
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