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Shennan Circuits: Storage-Type Package Substrates Exhibit the Strongest Growth in Q3
2025-12-02 /
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Author：小编
According to an institutional research report, Shennan Circuits revealed that its package substrate business encompasses a wide variety of product categories. These include module - type, storage - type, and application processor chip package substrates. These products are mainly utilized in mobile smart terminals, servers, storage devices, and other related fields. During the third quarter of 2025, the revenue generated from package substrates witnessed a quarter - on - quarter increase. This was due to the improving demand for products across various downstream sectors. Notably, among all these, storage - type package substrates showcased the most significant growth.
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