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On December 2, Malaysian Prime Minister Anwar Ibrahim made public that Intel Corporation is set to inject an additional 860 million ringgit (roughly equivalent to USD 208 million) into expanding its packaging and testing facilities in Penang and Kulim. The overarching goal is to cement Malaysia's status as a pivotal operational center for Intel's worldwide packaging and testing operations. This investment will be rolled out in phases leading up to 2026, and will be used to introduce cutting-edge packaging and testing production lines, modernize automated machinery, and provide training for local engineers. Malaysia currently commands about a 13% stake in the global market for chip packaging, assembly, and testing. Intel's latest investment is poised to further solidify Malaysia's indispensable role in the global semiconductor supply chain.
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