On December 1st (local time), Malaysian Prime Minister Anwar Ibrahim held a meeting with Pat Gelsinger, CEO of Intel Corporation. During the discussion, the two sides delved into the evolving trends within the semiconductor industry. Prime Minister Anwar revealed that Intel has pledged an additional investment of 860 million Malaysian ringgit (equivalent to approximately US$208 million) to bolster its packaging and testing facilities in Penang and Kulim, Malaysia. The objective is to position these sites as pivotal operational hubs for Intel’s global packaging and testing operations, with the investment slated to be rolled out in phases until 2026.
