Search
TSMC Looks Forward to Customized HBM4E Memory: Integrated Memory Controller on N3P Process-Based Base Die
2025-11-28 /
Read about 0 minute
Author：小编
According to images shared on social media by Andreas Schilling, editor of German media outlet Hardwareluxx, on the 25th of this month, TSMC elaborated on its insights into the first-generation customized HBM memory at the European session of the 2025 OIP (Open Innovation Platform) Ecosystem Forum held in Amsterdam, Netherlands. TSMC shares the same view as Sumit Sadana, Chief Business Officer of Micron, believing that customized HBM will be officially applied in the HBM4E era, with TSMC naming its related products C-HBM4E. In the HBM4 era, TSMC offers two different HBM Base Die process solutions, namely N12FFC+ for the mainstream market and N5 for higher performance.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
