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On November 24, 2025, Hangzhou MINAICORP Electronic Technology Co., Ltd. (hereinafter referred to as "MINAICORP") received an invitation to attend the "2025 RISC-V Industry Development Conference & RDSA International Forum" held in Zhuhai. During the event, MINAICORP's Chief Scientist took the stage at the "RISC-V Emerging Technologies and Application Scenarios Sub-Forum" to deliver a live presentation. The scientist offered an in-depth look at the company's latest advancements and groundbreaking achievements in developing a large-model inference chip that leverages 3D-CIM™ (Three-Dimensional Computing-In-Memory) technology. This innovative chip is built upon the RISC-V heterogeneous architecture, known as RV-CIM™, marking a significant leap forward in the field.
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