On November 17th, Loongson unveiled a detailed record of its investor relations activities. Notably, it was highlighted that the 9A1000 represents Loongson's inaugural GPGPU chip, seamlessly integrating graphics processing capabilities with AI computing prowess, making it suitable for AIPC applications. This chip has already been submitted for tape-out at the end of September and will undergo a series of subsequent processes, which will necessitate a certain duration for completion. Furthermore, the 3D7000, a server chip boasting over 32 cores and crafted using the advanced Xnm process, stands as a pivotal R&D endeavor for Loongson spanning from 2025 to 2027. In the meantime, taking into account the advancements in the Xnm process, the company might prioritize the development of the 3C6600, a 16-core server chip leveraging the 1Xnm process. Presently, the company has embarked on the IP design phase for the cutting-edge X-nanometer process.