Search
Orbbec: Achieving Remarkable Progress with Over 10 Chip Tape-outs, Including iToF, dToF Photosensitive Chips, and Specialized ASIC Computing Chips
2025-11-14 /
Read about 0 minute
Author：小编
On November 14th, Orbbec made an announcement highlighting the precision of its 3D visual perception technology in capturing three-dimensional spatial data. When integrated with its proprietary algorithms, this technology empowers a diverse range of AI-driven smart devices with essential capabilities such as environmental awareness, intelligent interaction, and dynamic navigation. Orbbec embarked on its independent chip research and development (R&D) initiative in the second year following its inception. To date, the company has successfully completed tape-outs for more than 10 chips, encompassing iToF, dToF photosensitive chips, as well as specialized ASIC computing chips, among others.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
