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Researchers at the Chinese Academy of Sciences Attain Direct Bonding of Two-Dimensional Semiconductor Wafers
2 day ago /
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Author：小编
Recently, a research team helmed by Zhang Guangyu from the Institute of Physics at the Chinese Academy of Sciences and the National Research Center for Condensed Matter Physics in Beijing, has successfully devised a direct wafer bonding and debonding technique. This innovation facilitates the creation of high-quality, wafer-scale stacks of two-dimensional semiconductors. The process can be carried out in either a vacuum or a glovebox setting, eliminating the need for transfer media. This ensures an exceptionally clean surface/interface condition and enables uniform angular control at the wafer level.
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