From Chips to Systems: How Does EDA Tackle the Challenges in AI Hardware Design?
2025-11-02 / Read about 0 minute
Author:小编   

On October 31, 2025, the 2025 Xipei Semiconductor User Conference convened in Shanghai, under the theme of "Intelligent-Driven Design, Chip-Enabled Intelligence (AI+EDA For AI)." The conference zeroed in on the profound integration of large AI models and EDA, delving into hardware design innovation and the collaborative construction of ecosystems spanning from chips to systems in the age of artificial intelligence.

Dai Wenliang, the founder of Xipei Semiconductor, expounded on the trend of EDA and AI integration. He highlighted that the demand for large AI models has surged, advanced packaging for Chiplets has become pivotal, and EDA tools must now be equipped with cross-dimensional, system-level design capabilities. During the conference, Xipei Semiconductor unveiled the Xpeedic EDA 2025 software suite. This suite encompasses three core platforms and offers six industry-specific solutions to streamline the design of AI hardware facilities.