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AOSMIC Extends a Heartfelt Invitation: Join Us at CSPT 2025 to Unlock the Future of Cutting-Edge Packaging Tech!
2025-10-28 /
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Author：小编
The highly anticipated 2025 China Semiconductor Packaging and Testing Exhibition, coupled with the Packaging and Testing Technology and Market Conference (CSPT 2025), is set to take place at the Huaian Sports Center from October 28 to 29. AOSMIC has the honor of being invited to participate in this prestigious event. During the conference, we will deliver a keynote speech at the [2.5D/3D Integrated Packaging Conference], where we'll offer an in-depth exploration of how artificial intelligence (AI) is revolutionizing advanced packaging technology.
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