By 2025, Samsung Electronics has rolled out a strategy to slash prices by 30% in a determined bid to reclaim its leading position in the High-Bandwidth Memory (HBM) market. This move is aimed at compensating for the losses incurred due to prior delays in certification processes. At present, Samsung's 12-layer HBM3E chips have commenced shipments to NVIDIA. However, the company is up against intense competition.

Samsung is bypassing the 1b DRAM node and opting to directly develop HBM4 chips based on the 1c DRAM node. It is anticipated that the pricing of these new chips will be lower than that of its competitors. Despite lingering issues with thermal management that have yet to be resolved, Samsung remains hopeful that it can regain market share through its aggressive pricing tactics. Nevertheless, the actual impact of this strategy still awaits market validation.

Currently, the HBM market is witnessing escalating levels of competition. Industry giants such as Samsung, SK Hynix, and Micron are engaged in a fierce battle for dominance, leaving the future trends of the market shrouded in uncertainty.