In recent times, TSMC has ramped up its efforts to relocate its advanced - process production capabilities overseas. The company's investment in the United States has soared to a staggering US$165 billion. Looking ahead, both the 2nm and 1.4nm processes are slated to be manufactured in the US. Meanwhile, Japan stands as TSMC's second - most important investment destination. A few years back, its first wafer fab was already established in Kumamoto Prefecture, which is dedicated to producing chips with process nodes ranging from 28nm to 12nm. Recently, TSMC officially confirmed that an agreement has been inked for its second wafer fab in Japan. This new facility is anticipated to kick - start operations in 2027.
