In a research report, CSC Securities highlights that as the semiconductor industry progresses towards more intricate manufacturing processes, the challenge of chip "hotspots" becomes increasingly pronounced. This, in turn, fuels the need for effective heat dissipation solutions. Diamond, recognized as an exemplary heat dissipation material, stands out due to its exceptional thermal conductivity and a host of other outstanding properties. These characteristics endow it with significant advantages, especially in demanding operational environments. The various forms in which diamond can be applied effectively address core heat dissipation requirements, with chemical vapor deposition emerging as the predominant method for its preparation. Both domestic and international companies have already introduced products incorporating this material. Given the escalating demand for computing power and the ongoing development of third-generation semiconductors, diamond's potential in the high-end heat dissipation market appears particularly promising.