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The Stacked Layer Count in Hybrid CMOS Chips Soars, Propelling Electronic Devices Toward Miniaturization and Enhanced Performance
2025-10-21 /
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Author：小编
A team of researchers at King Abdullah University of Science and Technology in Saudi Arabia has made a significant leap forward in microchip design. They have successfully crafted the world's inaugural 6-layer stacked hybrid CMOS chip, tailored specifically for large-scale electronic devices. In the past, the number of stacked layers in hybrid CMOS technology had remained capped at two. This groundbreaking achievement heralds a new era in chip integration density and energy efficiency, playing a pivotal role in the ongoing quest to miniaturize and boost the performance of electronic gadgets.
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