Recently, Tongchuang Purun proudly declared the successful completion of its Pre - IPO funding round. This round saw the joint participation of Shangqi Capital and SAIC Financial Holdings, which is the strategic direct investment fund of SAIC Group. The scale of this financing effort surpassed 1 billion yuan.

The raised funds are earmarked to bolster Tongchuang Purun's research and development endeavors in core technologies. This will serve as a catalyst to expedite technological advancements and industrial upgrades.

At present, Tongchuang Purun has firmly carved out its own niche in China's semiconductor materials industry. It has emerged as a front - running enterprise in the domestic market. With a diverse portfolio of ultra - high - purity materials in mass production and cutting - edge technology, the company has not only secured a strong position domestically but also successfully ventured into the international arena.

Its products have successfully infiltrated the supply chains of top - tier global wafer manufacturers. This achievement places Tongchuang Purun among the select few Chinese enterprises capable of supplying crucial materials for 3 - nanometer chips.