As the globe's premier semiconductor foundry, TSMC is at the forefront of the industry's push for energy conservation, implementing strategies to curb energy use in advanced process manufacturing. Presently, TSMC has tapped into even greater efficiency within its EUV systems, with the latest unveiled solution signaling the company's shift towards more instantaneous and intelligent energy management. In September of this year, TSMC officially rolled out the 'Dynamic Energy-Saving Management Program' at its primary production hub in Taiwan, with a particular emphasis on EUV systems. The company anticipates extending this solution to all EUV equipment worldwide within the year and fully integrating it into new factory zones. Projections indicate that by 2030, the system could accumulate power savings of up to 190 million kilowatt-hours and slash carbon emissions by roughly 101,000 metric tons. The crux of the new solution likely lies in an intelligent adjustment mechanism that can dynamically allocate energy consumption based on the actual exposure periods of wafers. During equipment downtime, power consumption can be promptly reduced, thereby boosting energy utilization efficiency. Prior to this, through internal redesign and optimization, TSMC had already cut the energy consumption of its new-generation system by about 25%, achieving a peak power reduction of up to 44% for the equipment, all without impacting process output, yield, or product quality.