YMTC Unveils Plans to Foray into DRAM Market, with a Focus on HBM Development
6 day ago / Read about 0 minute
Author:小编   

On September 26, 2025, news surfaced that YMTC, a prominent NAND flash memory producer in China, is gearing up to step into the DRAM market and is set to develop DRAM products, encompassing High Bandwidth Memory (HBM). HBM stands as a pivotal technology in the realm of AI chip production. At present, the global HBM market is predominantly controlled by U.S.-based Micron, along with South Korea's SK Hynix and Samsung.

YMTC has already embarked on research into Through-Silicon Via (TSV) technology, which is crucial for creating stacked DRAM structures. Additionally, the company is contemplating reallocating a portion of the production capacity at its newly constructed factory in Wuhan to DRAM manufacturing.

Historically, YMTC has amassed a wealth of experience in the flash memory sector. Its Xtacking technology has successfully achieved mass production of 270-layer stacking, and the company holds a substantial number of patents related to hybrid bonding. By venturing into the DRAM market, YMTC is poised to collaborate with companies like CXMT, working in tandem to propel the advancement of domestic HBM technology.