TSMC has recently disclosed the latest technical specifics of its A14 semiconductor fabrication process. This process is anticipated to outperform the current 2-nanometer platform in both performance and energy efficiency. Analyst Ray Wang reports that the A14 process development has surpassed initial projections, with trial production yields outpacing the internal timeline. The A14 process incorporates second-generation GAA (Gate-All-Around) nanosheet transistors along with the NanoFlex Pro architecture. When compared to the N2 process, it delivers a 15% increase in speed at equivalent power consumption levels, or alternatively, a 30% reduction in power consumption while maintaining the same speed. Additionally, there is an over 20% increase in logic density. Production of this process is slated to commence in 2028, with a focus on serving the AI-powered high-performance computing and smartphone sectors.