Chipmore Technology revealed in an institutional survey that the display chip packaging and testing business will experience growth in the second half of 2025. The effect of the display industry's relocation continues to manifest, with demand for large-sized COF and TDDI COG driven by factors such as the continuation of national subsidies and sporting events, leading to a rapid increase in demand in the third quarter, with further growth expected in the fourth quarter. Meanwhile, expectations for small-sized TDDI repair and brand demand are increasing, and the penetration rate of AMOLED is also continuously rising. Regarding the non-display chip packaging and testing business, Cu bump is expected to grow quarter by quarter. Although the utilization rate of DPS in the first half of the year was not ideal, it is expected to rebound in the second half of the year. The company maintains a cautiously optimistic outlook overall.