On September 25th, LiOn Microelectronics disclosed on an interactive platform that its compound semiconductor RF and optoelectronic chip operations are anchored by two key facilities: Hangzhou Dongxin and Haining Dongxin. The Hangzhou site boasts an annual production capacity of 90,000 wafers. Meanwhile, the Haining site is slated to have an annual production capacity of 360,000 wafers, with 60,000 wafers already produced. The current annual production capacity stands at 150,000 wafers, which, when operating at full tilt, can yield an approximate output value of RMB 1 billion. The pricing of the company's 6-8 inch silicon wafer products is subject to market supply and demand dynamics, and the company is vigilantly tracking market trends to make flexible adjustments to product prices. Concurrently, the production capacity for the company's 12-inch products is experiencing a swift upsurge.