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On September 24, information from the Qichacha APP revealed that Alibaba (China) Co., Ltd. has recently made public a patent titled "Integrated Circuit Component and Chip Packaging Structure". According to the patent's abstract, this integrated circuit component is composed of two primary parts: a first wafer die and a second wafer die. The first wafer die is engineered with multiple arithmetic units capable of conducting logical operations simultaneously, showcasing a parallel processing capability. The second wafer die, positioned atop the first, incorporates multiple access control units. In this setup, each arithmetic unit is paired with several access control units. It transmits data access commands to at least one of these access control units, which then execute the data access operations in response to the received instructions.
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