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According to the investor relations activity record disclosed by Goke Microelectronics, its series of in-vehicle AI chips have already found their way into applications such as front-mounted intelligent cameras. In the first half of 2025, the company's latest generation of in-vehicle AI chips, which adhere to the rigorous AEC-Q100 Grade2 standard, have completed their return process and successfully powered up. At present, rigorous verifications are in full swing, accompanied by proactive promotional efforts. Looking ahead, the company has set its sights on introducing a full spectrum of in-vehicle AI chips over the next three years, featuring a wide range of computing power from entry-level to high-performance, and encompassing production capacities spanning from 2 million to 8 million units.
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