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Telink Semiconductor: Head audio customers have entered mass production for edge-side AI chips
2 day ago /
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Author：小编
On September 19th, during the 2025 mid-year performance meeting, Telink Semiconductor's General Manager Sheng Wenjun introduced the layout of IoT edge processing chips. He stated that the company's launched edge-side AI chips are general-purpose and can be widely applied in multiple fields such as audio, smart home, and healthcare. Currently, some leading audio customers have entered the mass production stage, while projects in automotive, module, gaming, and some Google-related initiatives are in small-scale production, with additional projects still in the design phase. In the second quarter of this year, the chip's sales reached a scale of tens of millions of yuan.
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