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Based on the investor relations activity record table announcement issued by Tongfu Microelectronics, the company has made remarkable strides in FCBGA packaging technology during the first half of the year. Specifically, large-scale FCBGA production has commenced, and the preliminary research on extra-large-scale FCBGA has been finalized, now advancing to the engineering evaluation phase. The company has effectively tackled the challenges of warping and heat dissipation in extra-large-scale products through meticulous optimization of product structural design, material selection, and manufacturing processes. Moreover, the company has also attained significant breakthroughs in the research and development of Co-Packaged Optics (CPO) technology, with its related products successfully passing the preliminary reliability tests.
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