Data from research institutions reveals that in the second quarter of 2025, the revenue of the global semiconductor wafer foundry 2.0 market experienced a 19% year-on-year surge. Advanced processes and advanced packaging technologies emerged as the primary engines propelling this growth. Notably, TSMC witnessed a significant rise in its market share, climbing from 31% in the second quarter of 2024 to an all-time high of 38% in the second quarter of 2025. This remarkable achievement can be largely credited to the ramp-up of its 3nm process and the expansion of its CoWoS packaging capacity.