In the realm of cutting-edge semiconductor manufacturing, Japan's Rapidus has swiftly risen as a notable contender. Established in 2022, the company has set an ambitious goal to commence mass production of the 2nm process by 2027. Prior to this endeavor, Japan's domestic advanced logic process technology had only advanced as far as 28nm, with no prior experience in mass-producing processes below the 10nm threshold. This time around, however, Rapidus is making significant strides, directly bridging the gap with industry giants such as TSMC, Samsung, and Intel in terms of 2nm node development. Rapidus has successfully accomplished the tape-out of 2nm Gate-All-Around (GAA) test chips, with the node process achieving the predetermined electrical performance benchmarks. Leveraging ASML's extreme ultraviolet lithography machines, Rapidus is manufacturing its 2nm chips. By 2027, the monthly production capacity of its IIM-1 factory is projected to reach 25,000 wafers. The company employs a comprehensive single-wafer processing approach throughout the entire production process, enabling early anomaly detection and prompt adjustments to process conditions, thereby enhancing yield rates. Additionally, Rapidus has forged partnerships with IBM and other entities to co-develop mass-production technology for advanced packaging of 2nm process chiplets.