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When pitted against traditional silicon - based chips, Flex ICs (flexible integrated circuits) boast a remarkable advantage in terms of thickness, being merely one - third as thick. Moreover, their production cycles witness a drastic reduction, shrinking from months to a mere few days, covering the entire process from raw material procurement to final product delivery. And all this comes at a lower manufacturing cost. At present, Flex ICs aren't designed to usurp the position of silicon - based chips; instead, they're on a mission to pioneer new application realms. At the 2025 International Internet of Things Exhibition (IOTE) held in Shenzhen, Pragmatic, a global frontrunner in the field of flexible semiconductors, put its flexible wafers and associated product solutions on full display, drawing a great deal of attention.
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