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NVIDIA Aggressively Advocates for Silicon Carbide Interposer, Sparking a Surge in Taiwan's Silicon Carbide Sector
3 day ago /
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Author：小编
As per reports from Taiwanese media outlets, NVIDIA is set to substitute traditional silicon interposer materials with silicon carbide in the sophisticated packaging process of its forthcoming Rubin processor. This strategic shift aims to amplify GPU performance. Such a development has ignited a flurry of activity within Taiwan's silicon carbide industry. Silicon carbide boasts superior thermal conductivity, effectively mitigating the intense heat produced by high electrical currents. Taiwanese producers possess a competitive edge in slicing technology and the production of large-diameter single-crystal silicon carbide wafers. Notably, TSMC is actively engaged in the advancement of pertinent technologies.
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