NVIDIA is set to elevate the performance of its next - generation Rubin processor by substituting the silicon material of the interposer within the CoWoS advanced packaging technology with silicon carbide (SiC). In the realm of semiconductor manufacturing, CoWoS (Chip - on - Wafer - on - Substrate) is a well - established advanced packaging technique.

At present, TSMC is working hand - in - hand with leading manufacturers to pioneer manufacturing technology for silicon carbide interposers. In Western tech industries, such collaborative efforts between major players like TSMC and other manufacturing giants are quite common as they strive to push the boundaries of technological innovation.

Although the first - generation Rubin GPU from NVIDIA will still rely on a silicon interposer, given its exceedingly high performance demands, silicon carbide will emerge as an indispensable option once the internal heat generation of the chip surpasses its thermal threshold. In the context of chip design and manufacturing, managing heat is a critical factor that directly impacts the performance and longevity of the device.

It is anticipated that silicon carbide will make its debut in the advanced packaging field no later than 2027.