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A report by Goldman Sachs highlights the growing investor interest in Taiwan-based advanced packaging equipment manufacturers, Advanced Semiconductor Engineering (ASE) and ASE Test Limited (ATL). Investors perceive that the capacity contributions of outsourced packaging and testing facilities may be underestimated. Projections indicate that by 2027, the total capacity for Chip-on-Wafer-on-Substrate (CoWoS) technology will approximate 200,000 wafers. Goldman Sachs analyzes that the escalating complexity in chip design is driving a persistent increase in the demand for advanced testing equipment, thereby presenting these two companies with structural growth opportunities. It is anticipated that by 2027, FormFactor and MJC will capture 11% and 14% of the global market share in the probe card and socket markets, respectively.
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