AMD is vigorously pursuing the development of its next-generation GPU products, with plans to integrate both 2.5D and 3.5D chiplet packaging technologies. This dual-pronged approach, encompassing multi-chip modules and monolithic chip architectures, aims to bolster AMD's competitiveness in the high-performance GPU market. While AMD's Radeon RX 9000 series graphics cards have yet to make a direct dent on major competitors, the company's latest technological advancements signify its proactive strategy for the future of GPUs. Laks Pappu, an AMD executive, has shed light on the development roadmap for the Navi4x and Navi5x product generations, highlighting the benefits of 2.5D and 3.5D packaging technologies in enhancing interconnect bandwidth and optimizing energy efficiency. These advancements are particularly suited for applications in high-performance computing and data centers. Although specific launch dates for these products remain under wraps, AMD's technological trajectory underscores its ambition to elevate performance while keeping costs in check through the ongoing evolution of chiplet packaging technology.