Xinsheng Semiconductor Closes B+ Round of Funding, Advancing High-End Packaging Equipment Manufacturing
2 week ago / Read about 0 minute
Author:小编   

Xinsheng Semiconductor, a pioneering manufacturer specializing in semiconductor packaging equipment, has successfully concluded its B+ round of financing, led by esteemed investor Yuanhe Puhua. This strategic infusion of capital will enable Xinsheng Semiconductor to refine its product portfolio, broaden its market reach, and fortify its technological prowess in the realm of premium packaging solutions.

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