RDI Micro Tech Surpasses Computing Power Constraints with System-on-Wafer, Unveiling 3DIS™ Platform to Pioneer Advanced Packaging Innovations

2025-08-28 / Read about 0 minute

Author：小编

From August 26th to 28th, the esteemed 9th China System-in-Package (SiP) Conference convened at the Futian Convention and Exhibition Center in Shenzhen. The conference delved into the escalating tension between the burgeoning demands for AI computing power and the deceleration of Moore's Law, emphasizing the potential of advanced packaging and Chiplet technology. RDI Micro Tech, a leading provider of comprehensive packaging and testing solutions tailored for Chiplet and high-end chip design and fabrication, made a groundbreaking debut with its 3DIS™ advanced packaging platform at the exhibition, showcasing its formidable technical prowess and groundbreaking achievements.

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