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SK Hynix Unveils Pioneering High-K Thermal Dissipation DRAM with 3.5x Enhanced Thermal Conductivity
2025-08-28 /
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Author：小编
SK Hynix has introduced the groundbreaking industry's first mobile DRAM that utilizes High-K EMC material for efficient thermal dissipation, and has commenced shipments. EMC, a vital component in semiconductor packaging, safeguards chips from adverse external conditions like moisture and heat, while also exhibiting remarkable thermal dissipation properties. By integrating High-K EMC material, SK Hynix has dramatically improved the DRAM's thermal dissipation capabilities, effectively addressing the heat generation challenges posed by high-speed data processing in edge AI applications. This innovative advancement has garnered significant acclaim from customers worldwide.
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