TSMC's cutting-edge 2nm process technology (N2) is anticipated to commence mass production in the fourth quarter of 2025, with pioneering collaborations already established or soon to be initiated by tech giants including Apple, AMD, and Qualcomm. Commencing in 2026, customer tape-outs are poised to witness a significant surge, and by 2027, an array of manufacturers will join the mass production bandwagon, fueling robust demand growth. TSMC is vigorously expanding its production capacity at its facilities in Baoshan, Hsinchu, and Kaohsiung, while its Arizona plant in the United States is expected to commence operations in 2028, at which point monthly 2nm capacity is projected to reach 200,000 wafers. Initially, Apple will command nearly half of this capacity, but from 2027 onwards, a broader spectrum of customers will expand their tape-outs. Furthermore, TSMC's N2P and A16 processes are set to enter mass production in the second half of 2026, with the A14 process anticipated to follow suit in 2028.