MicroView Intelligence Packaging Technology (Shenzhen) Co., Ltd. has recently announced the successful completion of a Series B funding round, raising over RMB 100 million from esteemed investors including Qianhai Financial Holdings, Momentum Capital, and Leaguer Tech Venture. This influx of capital will be strategically allocated towards advancing the company's research and development efforts in cutting-edge packaging technologies tailored for the AI era.

Established in 2019, MicroView Intelligence has emerged as a specialist in high-precision chip packaging equipment, pivotal in supporting the intricate packaging processes of third-generation semiconductor chips. The company's reach extends globally, with a clientele that includes numerous optical device manufacturers. In a notable milestone, MicroView Intelligence achieved the export of its high-precision die bonders to the European and American markets in 2023, marking a significant expansion with export orders comprising over 20% of its total order volume.