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Xindongli Technology has recently announced the successful completion of a B2 funding round, raising nearly 100 million yuan. This financing was led by Feitu Venture Capital and will primarily be allocated towards advancing the industrialization of RPP chips, enhancing technological research and development, and expanding the market for edge computing and AI chip inference. Founded in 2017, Xindongli Technology has established R&D centers across China and the United States. At the heart of the company lies its proprietary RPP architecture, which seamlessly integrates the strengths of NPU and GPU, boasts impressive ecological compatibility, and delivers ultra-high energy efficiency, thereby providing groundbreaking solutions for AI computing.
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