NVIDIA is embarking on the development of its proprietary 3nm HBM Base Die, aiming to elevate data transmission efficiency and bolster the NVLink ecosystem. This strategic move seeks to disrupt the ASIC market, although it currently faces limited adoption among major cloud service providers (CSPs). As NVIDIA gears up for in-house production of the Base Die and SK Hynix accelerates mass production of HBM4, the HBM market braces for a fresh wave of competition and transformation.