Nvidia's forthcoming entry into the High Bandwidth Memory (HBM) base die market has garnered significant industry attention. This sector is presently a hotbed of competition, dominated by leading DRAM manufacturers. Amidst the intensifying complexity of manufacturing processes, ASIC vendors like Innosilicon are now turning their focus to this promising arena. Industry analysts posit that while major CSP manufacturers may not readily adopt Nvidia's solution, partners in the NVLink Fusion ecosystem, such as MediaTek and WorldSemi, stand to gain substantially from Nvidia's modular design approach. This collaboration could pave the way for these partners to secure additional business opportunities.