The 3rd AI Large Model Summit Forum recently convened in Beijing, centering on the commercial applications of AI technology. During the event, the collaborative project titled "Large Model-Driven Semiconductor Wafer Manufacturing Intelligent Agent Application," jointly developed by Zhixian Future and Nexchip, was awarded the prestigious "Best Practice Case Award for AI Agent." Leveraging their self-developed "Lingxi" large model, the project triumphantly tackled challenges such as data fragmentation and defect detection within the semiconductor manufacturing domain, achieving widespread implementation across multiple sites.

The partnership between Zhixian Future and Nexchip has epitomized complementary strengths, fostering groundbreaking AI applications in semiconductor manufacturing. This collaboration has significantly enhanced production efficiency and product quality, setting a benchmark for the intelligent transformation of the industry. The case underscores the profound practical value of AI Agent technology in industrial settings, potentially catalyzing the intelligentization of various industries.