CSIC highlights the accelerating commercialization of edge AI applications, with AI-infused devices like smartphones, PCs, and smart cars experiencing a rapid surge in market penetration. This momentum has fueled a significant increase in computing power demand, propelling advancements in sophisticated process and packaging technologies. Despite the impressive localization levels achieved by domestic semiconductor industries, there remains a critical need to break through in high-end chip production capacity. In light of this, it is imperative to focus on the development of domestic advanced process technologies, storage solutions, packaging techniques, as well as related equipment materials and EDA software sectors.