Houmo Intelligence, an AI chip company specializing in computing-in-memory technology, has recently closed a Series B financing round totaling several billion yuan—marking yet another successful raise within the past year. This round attracted support from upstream and downstream industrial capital, state-owned capital, international investors, and multiple existing shareholders, underscoring the capital market's confidence in the company's technology roadmap and commercial prospects. Its edge large-model AI chip, the M50, has secured over 150 product design wins and serves more than 100 customers—less than a year after entering mass production. The proceeds from this round will be primarily used to scale up M50 deliveries, advance R&D of the next-generation M6X and next-generation 3D CIM products, enhance the software toolchain and industry ecosystem, and drive large-scale deployment of edge AI across a broader range of terminal scenarios.