November 2 — TrendForce's latest research on the AI infrastructure industry indicates that, driven by the continued expansion of AI server clusters and surging demand for accelerator bandwidth, the global AI network and interconnect output value is projected to grow from US$37.9 billion in 2024 to US$279.8 billion in 2027, representing a compound annual growth rate (CAGR) of 95% over that period. Market growth is shifting its focus from back-end network switches and optical modules to high-speed accelerator interconnects and network interface cards. Going forward, the shipment mix and network topology of various AI chip platforms will become key factors shaping market size and the distribution of supply chain value. From an interconnect standpoint, the output value of high-speed interconnects between AI chips is growing fastest. As GPU platforms evolve toward rack-level architectures, chip interconnects are gradually extending from server motherboards to independent switch trays, driving up demand for switching equipment and copper cables. Based on AI cluster deployment estimates, the share of Scale-up in AI network output value will rise from 11% in 2024 to 24% in 2027.