On October 12, foreign media outlets, citing informed sources, reported that Tencent disclosed to fixed-income investors on Monday its intention to raise approximately US$5 billion through bond issuance. This move aims to bolster capital expenditures related to artificial intelligence (AI) and ramp up investments in the AI sector. During a conference call with investors, Tencent mentioned that the bond pricing could be finalized as early as Tuesday. The bond issuance plan encompasses US dollar-denominated bonds ranging from US$1.5 billion to US$2 billion, alongside offshore RMB-denominated bonds valued between RMB 20 billion and RMB 25 billion (roughly equivalent to US$3 billion to US$3.7 billion). Tencent's management team clarified that the funds raised from this issuance would primarily be earmarked for general corporate needs, with a significant portion dedicated to AI-related capital expenditures, particularly focusing on chip procurement.