According to a research report released by Sinolink Securities, the construction of AI computing power is propelling the expansion of high-end PCB production. Concurrently, four major trends—high-layer count, advanced High-Density Interconnect (HDI), low-loss materials, and refined circuit lines—are driving equipment upgrades. Consequently, the PCB equipment industry is poised to capitalize on dual opportunities: a surge in overall prosperity and structural upgrades. Institutions are particularly bullish on three key sectors: ultrafast laser drilling, laminators, and exposure equipment. Ultrafast laser drilling is experiencing a surge in demand, driven by material upgrades, and is at the nascent stage of industrialization. Laminators are benefiting from a trifecta of factors—high-layer boards, material upgrades, and mSAP (modified Semi-Additive Process) technology—which are collectively accelerating the release of expansion needs. Exposure equipment is on the verge of an industrial explosion, fueled by the demand for refined circuit lines and upgrades in direct imaging technology. With the expansion of AI high-end board production and process upgrades, these three equipment markets present vast prospects. It is advisable to focus on leading manufacturers that possess technological advantages and mass production capabilities.