At its recent performance briefing, Telink Semiconductor disclosed that the deployment of its edge AI chips is rapidly expanding. These chips have already seen widespread adoption in the audio industry and are making steady inroads into smart home projects and other sectors. Looking ahead, it is anticipated that by 2026, the shipment volume of edge AI chips will continue its upward trajectory, with smart home projects emerging as significant contributors to the company's growth. Telink's TL-EdgeAI development platform facilitates the seamless conversion and training of AI models from mainstream frameworks, thereby reducing entry barriers for developers. Presently, the company is transitioning its product offerings from mere 'connectivity chips' to comprehensive 'intelligent node core control and communication platforms.' This strategic shift underscores the vast application potential and enhanced value proposition of Telink's offerings in the burgeoning era of edge AI.