On August 27, in an interview conducted the previous day (August 26), Madhukar Reddy, the Executive Vice President of Qualcomm, delved into Qualcomm's groundbreaking innovation in the AI data center realm—the HBC (High Bandwidth Computing) near-memory architecture. He emphasized that, in contrast to the prevalent HBM (High Bandwidth Memory) solution, the HBC architecture boasts superior effective bandwidth and lower power consumption, presenting a novel approach to tackle the 'memory wall' challenge prevalent in the AI era. The HBC architecture is highly adaptable, enabling customers to integrate additional computing units on the opposite side when implementing it, thereby optimizing system performance. This pioneering architecture has already garnered acclaim from major cloud service providers, with hyperscale cloud operators expressing significant interest in HBC technology and engaging in thorough discussions with Qualcomm. Concurrently, Qualcomm is also partnering with global memory manufacturers to propel the DRAM stacking technology essential for HBC forward.